ŞEHİR e-arşiv

Space transformer connector characterization for a wafer test system

Show simple item record

dc.contributor.author Tunaboylu, Bahadır
dc.date.accessioned 2018-01-14T09:49:24Z
dc.date.available 2018-01-14T09:49:24Z
dc.date.issued 2017
dc.identifier.citation Space transformer connector characterization for a wafer test system. Journal of Microelectronics, Electronic Components and Materials, 47(4), pp. 255-259. en_US
dc.identifier.uri http://hdl.handle.net/11498/49352
dc.description.abstract Standard connections from the probe head to the PCB for vertical type probe cards in wafer test are individual separate wires in space transformers (STs), traditionally used for device pitches 80 µm and above for quick turn inexpensive solutions compared to multilayer ceramic substrates. There are inherent signal integrity issues using separate wires in controlling impedance, bandwidth, and cross-talk of STs and probe cards. A method of wiring that includes parallel pairs and twisted pairs is proposed and electrical characterization was performed to establish predictive specifications on the test cards. en_US
dc.language.iso eng en_US
dc.publisher MIDEM en_US
dc.rights info:eu-repo/semantics/embargoedAccess en_US
dc.subject Semiconductors en_US
dc.subject Transformers en_US
dc.subject Yarı İletkenler en_US
dc.subject Transformatörler en_US
dc.title Space transformer connector characterization for a wafer test system en_US
dc.type Article en_US
dc.contributor.authorID 166606 en_US
dc.relation.journal Journal of Microelectronics, Electronic Components and Materials, en_US
dc.identifier.volume 47 en_US
dc.identifier.issue 4 en_US
dc.identifier.endpage 259 en_US
dc.identifier.startpage 255 en_US


Files in this item

This item appears in the following Collection(s)

Show simple item record

Search ŞEHİR e-arşiv


Advanced Search

Browse

My Account

Statistics